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Downhole Gas and Water Separation |
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here to find out how DHI DGWS technology is unique
The amount of economically recoverable
gas reserves can be increased through use of downhole
gas and water separation (DGWS) technology. Such systems
allow natural gas to be physically separated from water
in the same wellbore while simultaneously injecting
the water into a suitable geologic disposal zone. That
is, no water or water pressure is ever produced to the
surface. Use of this technology will reduce or eliminate
some of the economic and environmental problems associated
with water produced to the surface.
Water, co-produced with natural gas, adversely affects
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economics of gas production in a variety of ways if, as is
conventionally the case,that water must be brought to the
surface for processing and disposal. However, DGWS technology
is a potential candidate whenever water, co-produced with
gas, adversely affects the economics of the gas production
and where this economic burden is sufficient to discourage
and/or limit the commercial development of natural gas. Beyond
the issue of economics are the adverse environmental impacts
of conventional surface water processing and transportation
methods. These issues have a particularly large influence
in remote basins. Such basins contain environmentally sensitive
natural areas and have more limited access to affordable surface
water handling options.
This technology has been under development by DHI for the
past eight (8) years and has gone through several revisions
and is now ready for the commercial market. The latest version
of the DGWS technology, the RFI system has been tested in
over 20 gas wells the past few years with great success. For
more information or case studies please contact DHI engineering.
The reverse flow injection (RFI) system is a DGWS process
that is protected by two (2) patents and by a process patent
that are pending: the below production disposal system is
protected under patent # US 5,425,416, and the above production
disposal system is protected under patent # US 5,579.838.
In addition, the Down Hole Stuffing Box (DSB) and Barrel Seal
Manifold (BSM) are patent pending. DHI plans to apply for
several more patents in 2004.
Comprehensive specifications are available to qualified customer
candidates upon request.
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